Apply for WorldBank Group ID4D Mission Billion Challenge 2019 Here.
WorldBank Group ID4D Mission Billion Challenge 2019… Despite significant progress in recent years, one billion people are still unable to prove their identity, and millions more have forms of identification that cannot be reliably verified or authenticated. In an increasingly digital age, the lack of verifiable identification often results in exclusion from economic opportunities and a variety of social and political rights.
For the inaugural Mission Billion Challenge, the ID4D Initiative will start with an issue at the heart of digital identification design: privacy and user empowerment of their identification. As countries and development partners strive to provide identification to millions of people, there is an opportunity to inform the design of digital identification systems to enhance data protection and provide individuals with greater control over their personal data. The Challenge aims to surface practical and cost-effective ‘privacy by design’ features that can be embedded into digital identification systems.
How can digital identification systems in developing countries be better designed or adapted to protect people’s privacy and empower them with greater control over their personal data?
The Challenge has up to $100K in prizes for most promising ideas.
Cash prizes totaling $100,000 with a top prize of $50,000.
Mission Billion is open to:
- Individuals, including academics, entrepreneurs, scientists, technologists and other engaged citizens
- Organizations, involved in research, advocacy, design and implementation of digital identification systems
Method of Application
Through the MIT Solve platform, innovators and organizations, can submit a solution to the Mission Billion Challenge. Submissions will be evaluated by committees formed of staff members of the World Bank and partner organizations. The final evaluation panel will be composed of globally recognized experts in the field of digital identification systems.
For more information, visit the Official Website
Application Deadline: February 24, 2019
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